Conduct thermal analysis on a variety of system and component level items using FEMAP Thermal and FEMAP Flow (MAYA TMG Solver) based FEA modeling. Work with project engineers to develop thermal models of hardware design and be able to interpret analysis results for design modification and/or identify area of interest to verify by testing. Validate thermal models using simple experimental set-ups. Generate reports to capture analytical and practical model validation. Support thermal testing including developing thermal test plan, conducting test, and reporting results.
Bachelors of Mechanical or Aerospace Engineering with 3-5 years experience with emphasis on thermal modeling and heat transfer/thermal experimentation. Candidate should be comfortable using FEMAP pre/post finite element modeling software or equivalent and be able to use hand calculation to develop modeling parameters such as thermal interface conductivity/resistance, orthotropic PCB conductivity, and component junction temperatures. Experience using FEMAP is required.